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| 2SJ386 Silicon P-Channel MOS FET Application High speed power switching Features * * * * * Low on-resistance High speed switching Low drive current 4 V gate drive device can be driven from 5 V source Suitable for Switching regulator, DC - DC converter Outline TO-92 Mod D G 32 1 1. Source 2. Drain 3. Gate S 2SJ386 Absolute Maximum Ratings (Ta = 25C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Note: 1. PW 10 s, duty cycle 1 % Symbol VDSS VGSS ID I D(pulse)* I DR Pch Tch Tstg 1 Ratings -30 20 -3 -5 -3 0.9 150 -55 to +150 Unit V V A A A W C C Electrical Characteristics (Ta = 25C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Symbol V(BR)DSS V(BR)GSS I GSS Min -30 20 -- -- -1.0 -- -- Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time |yfs| Ciss Coss Crss t d(on) tr t d(off) tf 1.0 -- -- -- -- -- -- -- Typ -- -- -- -- -- 0.3 0.55 1.7 177 120 59 8 28 45 60 Max -- -- 10 -10 -2.5 0.4 0.8 -- -- -- -- -- -- -- -- Unit V V A A V S pF pF pF ns ns ns ns Test conditions I D = -10 mA, VGS = 0 I G = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = -24 V, VGS = 0 I D = -1 mA, VDS = -10 V I D = -2 A VGS = -10 V*1 I D = -2 A VGS = -4 V*1 I D = -1 A VDS = -10 V*1 VDS = -10 V VGS = 0 f = 1 MHz I D = -2 A VGS = -10 V RL = 15 Zero gate voltage drain current I DSS Gate to source cutoff voltage Static drain to source on state resistance VGS(off) RDS(on) 2 2SJ386 Maximum Channel Dissipation Curve Pch (W) 1.6 I D (A) -10 -3 -1 -0.3 -0.1 C D Maximum Safe Operation Area 100 s PW 1 m 1.2 s = 10 Channel Power Dissipation m s 0.8 Drain Current 0.4 Operation in this area is limited by R DS(on) n tio ra pe O -0.03 -0.01 0 50 100 150 Ta (C) 200 -0.1 Ta = 25 C 1 shot pulse -0.3 -1 -3 -10 -30 -100 Ambient Temperature Drain to Source Voltage V DS (V) Typical Output Characteristics -2.0 -5 V -4 V -3.5 V -5 -3 V Typical Transfer Characteristics V DS = -10 V Pulse Test I D (A) -1.2 ID Ta = 25 C Pulse Test -2.5 V (A) -1.6 -4 Drain Current -3 Ta = -25 C 25 C Drain Current -0.8 -2 75 C -0.4 VGS = -2 V -1 0 -2 -4 -6 Drain to Source Voltage -8 -10 V DS (V) 0 -1 -2 -3 Gate to Source Voltage -4 -5 V GS (V) 3 2SJ386 Drain to Source Saturation Voltage vs. Gate to Source Voltage Ta = 25 C Pulse Test Drain to Source On State Resistance R DS(on) ( ) -5 Drain to Source Saturation Voltage V DS(on) (V) Static Drain to Source on State Resistance vs. Drain Current 10 Ta = 25 C 5 Pulse Test -4 2 1 VGS = -4 V -10 V -3 -2 I D = -5 A -1 -3 A -1 A 0 -4 -8 -12 Gate to Source Voltage -16 -20 V GS (V) 0.5 0.2 0.1 -0.1 -0.2 -0.5 -1 -2 -5 Drain Current I D (A) -10 Static Drain to Source on State Resistance R DS(on) ( ) I D = -3 A 0.8 V GS = -4 V 0.6 I D = -5 A 0.4 -3 A 0.2 0 -40 VGS = -10 V -1 A -1 A Forward Transfer Admittance |y fs | (S) Static Drain to Source on State Resistance vs. Temperature 1.0 Forward Transfer Admittance vs. Drain Current 10 5 Ta = -25 C 2 25 C 1 0.5 75 C 0.2 0.1 -0.1 -0.2 V DS = -10 V Pulse Test -0.5 -1 -2 -5 Drain Current I D (A) -10 0 40 80 Ambient Temperature 120 160 Ta (C) 4 2SJ386 Typical Capacitance vs. Drain to Source Voltage 1000 V DS (V) 500 Capacitance C (pF) 200 100 50 0 V DD = -30 V -20 V -10 V I D = -3 A Dynamic Input Characteristics V GS (V) Gate to Source Voltage 5 0 -10 -4 Ciss Drain to Source Voltage Coss Crss VGS = 0 f = 1 MHz 0 -10 -20 -30 -40 -50 -20 V DD = -30 V -20 V -10 V V GS -8 -30 V DS -12 20 10 -40 -50 0 -16 -20 20 Drain to Source Voltage V DS (V) 4 8 12 16 Gate Charge Qg (nc) Switching Characteristics 200 100 Switching Time t (ns) 50 t d(off) 20 10 5 2 V GS = -10 V, V DD = -30 V PW = 2 s, duty < 1 % -0.5 -1 -2 -5 Reverse Drain Current vs. Source to Drain Voltage -5 Reverse Drain Current I DR (A) Pulse Test -4 tf -3 -10 V -5 V V GS = 0 tr t d(on) -2 -1 -0.05 -0.1 -0.2 0 -0.4 -0.8 -1.2 -1.6 -2.0 Drain Current I D (A) Source to Drain Voltage V SD (V) Unit: mm 4.8 0.3 3.8 0.3 0.65 0.1 0.75 Max 0.5 0.1 0.7 0.60 Max 2.3 Max 10.1 Min 8.0 0.5 0.5 1.27 2.54 Hitachi Code JEDEC EIAJ Weight (reference value) TO-92 Mod -- Conforms 0.35 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. |
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